Surface properties of polymeric materials with nanoscale functional coating

ABSTRACT

An electronic device comprising a substrate having a component-side surface and a moisture protection film covering the component-side surface. The moisture protection film includes a first water layer bonded to component-side surface that is an activated surface, wherein the activated surface has a lower water contact angle than the substrate surface before the surface activation. The film includes a first graphed layer of a plasma-reacted first set of precursor molecules graphed to the first water layer, wherein the first water layer forms a first bonding link between the substrate surface and the reacted first set precursor molecules. The film includes a second water layer bonded to the first graphed layer. The film includes a second graphed layer of a plasma-reacted second set of precursor molecules graphed to the second water layer, wherein the second water layer forms a second bonding link between the second water layer and the reacted second set of precursor molecules.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation application of U.S. application Ser. No.13/665,314 filed on Oct. 31, 2012, which in turn is a continuation inpart application of U.S. application Ser. No. 12/206,013 filed on Sep.8, 2008, entitled Surface Properties of Polymeric Materials withNanoscale Functional Coating to Yokley and Obeng, which in turn claimsthe benefit of U.S. Provisional Application Ser. No. 60/970,582 filed onSep. 7, 2007, entitled, Improving Surface Properties of PolymericMaterials by the Creation of Nanoscale Functional Coatings, to Yokleyand Obeng, and also claims the benefit of U.S. Provisional ApplicationSer. No. 61/564,415 filed on Nov. 29, 2011 entitled, Surface Propertiesof Polymeric Materials with Conformal Dry Nanoscale Functional Coatingsto Yokley and Obeng, all being incorporated herein by reference.

TECHNICAL FIELD

This application is directed, in general, to a process for depositingfilms, the films formed by the process and, more specifically, to aprocess for forming conformal surface film coatings for protectingelectronic and other devices.

BACKGROUND

There is a growing requirement for conformal barrier coatings or filmshaving high adhesion for corrosion protection, water proofing, surfacedecoration, for medical device passivation, circuit board moistureprotection, consumer electronic devices and a wide variety ofindustrial, consumer devices and similar objects. There is a need tobetter engineer the air-substrate interface of such films for specificapplications. For example, it is often desirable for films to modify thesubstrate surface without altering the bulk properties of the substrate.It is sometimes desirable to engineer films to have the potential toenhance the structural and functional performance of fabricatedpolymeric devices. Enhancement of the surface can occur with designedorganic, inorganic or hybrid polymeric coatings. However, many existingfilms suffer from poor adhesive bonding to the underlying surface, sincethe device materials construction are inherently non-reactive to reducethe incidence of reactions with the surrounding tissues.

SUMMARY

One embodiment of the disclosure provides an electronic device. Thedevice comprises a substrate having a component-side surface. The devicecomprises a moisture protection film covering the component-sidesurface. The moisture protection film includes a first water layerbonded to component-side surface that is an activated surface, whereinthe activated surface has a lower water contact angle than the substratesurface before the surface activation. The film includes a first graphedlayer of a plasma-reacted first set of precursor molecules graphed tothe first water layer, wherein the first water layer forms a firstbonding link between the substrate surface and the reacted first setprecursor molecules. The film includes a second water layer bonded tothe first graphed layer. The film includes a second graphed layer of aplasma-reacted second set of precursor molecules graphed to the secondwater layer, wherein the second water layer forms a second bonding linkbetween the second water layer and the reacted second set of precursormolecules.

BRIEF DESCRIPTION OF THE DRAWINGS

Reference is now made to the following descriptions taken in conjunctionwith the accompanying drawings, in which:

FIG. 1 shows a flow diagram showing steps in an example process of thepresent invention;

FIG. 2 shows a cross-sectional view of an example film formed on asubstrate is accordance with a process of the disclosure such as any ofthe embodiment discussed in the context of FIG. 1;

FIG. 3 shows a simulated time-of-flight secondary ion mass spectrometry(TOF-SIMS) trace of an example film formed on a substrate is accordancewith a process of the disclosure such as an embodiment (e.g., a one-passembodiment) of the film deposition process presented in FIG. 1;

FIG. 4 shows an optical interferometry of an example masked step edgeplasma-assisted silicon oxide (SiOx) deposited film on a glasssubstrate, produced in an example embodiment of the process flow in FIG.1, where tetraethoxysilane (TEOS) was used as the precursor in the stepfollowing the exposure of the cleaned and activated surface to watervapor;

FIG. 5 presents a summary of example air flow rate deviations measuredafter an example autoclave cycling tests such as described in Example 2of the application; and

FIG. 6 presents an example optical interferometry image of an example 60nm styrene film edge on a de-masked glass sample substrate in accordanceto with a process of the disclosure such as an embodiment of the processpresented in FIG. 1.

DETAILED DESCRIPTION

As part of the present disclosure, it was discovered that forming awater layer after a plasma cleaning and activating step enhances theformation of films, such as conformal films for the purpose of providinga moisture and environmental barrier to protect electronic or otherdevices. This discovery was made by accident when, between a firstplasma treatment to atomically clean and activate a substrate's surface,and a second plasma treatment to expose the activated surface topre-cursors molecules, the activated surface was inadvertently exposedto air having a high moisture content.

For the purposes of the present disclosure, the term atomically cleanedand activated, or, plasma cleaned and activated, refers to the treatmentof a substrate surface with low molecular weight molecules or atoms(e.g., Helium, Argon, Nitrogen, Neon, Silane, Hydrogen and Oxygen) inthe presence of a radiofrequency plasma, to clean the substrate'ssurface by making the surface free of contaminants such as organiccontaminants and water. Such a plasma treatment, referred to a firstplasma treatment herein, also actives the substrate's surface bybreaking up covalent and/or other chemical bonds of the substratemolecules at the surface, thereby making the substrate surface easier toreact with plasma treated pre-cursors molecule.

It is counter-intuitive to think that it would be beneficial to firstexpose such a cleaned and activated surface to water vapor beforeexposing the surface to plasma treated pre-cursors molecules. It iscounter-intuitive because one of the goals of such a plasma treatment isto remove contaminates from a surface, which typically includes removingwater from the surface. While not limiting the scope of the invention bytheoretical considerations, it is thought that exposure of the cleanedand activated substrate surface to water vapor results in the adsorptionor chemisorption of a water layer, e.g., one or more monolayers ofwater, onto the surface. It is thought that a water layer at theinterface between the substrate and grafted layered of various plasmatreated pre-cursors molecules promotes the formation of strong bondsbetween the grafted material and the substrate. A quantitative indicatorof the presences of such an activated surface is that the surfaces has alower water contact angle (e.g., at least about 10 percent and in somecases at least about 20 percent lower) than the substrate surface beforethe surface activation.

The term water layer as used herein refers to one or more self-assembledmonolayers of water molecules. For instance, the water layer can rangefrom a monolayer (e.g., a thickness of about 0.3 nanometers) to severalmonolayers (e.g., a thickness of about 2 nanometers). One skilled in theart would appreciate how the extent of adsorption and thickness of theresultant water layer would be controlled by the thermodynamicconditions present in the plasma chamber containing the substrate andwater vapor.

FIG. 1 shows a flow diagram showing selected steps in an example filmdeposition process 100 of the disclosure. FIG. 2 shows a cross-sectionalview of an example device 200 (e.g., a circuit board) have film 202formed on a substrate 205, in accordance with a process of thedisclosure such as any of the embodiment discussed in the context ofFIG. 1.

With continuing reference to FIGS. 1 and 2 throughout, the exampleprocess 100 comprises a first step 110 of exposing a surface 210 of asubstrate 205 to a first plasma treatment having plasma reactants in aplasma chamber 215 to form an activated substrate surface 210. Forinstance, in any of the embodiments of the process 100, the substrate205 can be a circuit board and the surface 210 is a component-sidesurface of the circuit board. In some embodiments the film layer 202 canbe a conformal coating designed to protect an electronic device, such asa circuit board, from moisture under autoclave sterilization conditions.

As discussed above, step 110 can serve to atomically clean and activatethe substrate's surface 210. The process 100 also comprises a step 120of introducing water vapor into the plasma chamber to form a water layer220 on the activated surface 210. The process 100 also comprises a step130 of introducing pre-cursors molecules into the plasma chamber 215 inthe presence of a second plasma treatment to graft a layer 225 ofreacted pre-cursor molecules on the water layer 220.

In some embodiments of the process 100, the first plasma reactants instep 110 are formed from one or more of Helium, Argon, Nitrogen, Neon,Silane, Hydrogen and Oxygen. In some cases reactants are in the presenceof the first plasma treatment that includes: a radiofrequency power inthe range of about 30 to 500 Watts, a temperature in range of about 0°C. to about 100° C. for a time period in a range of about 0.5 to 10minutes. In some such embodiments, the first plasma reactants are formedfrom Argon at pressures between about 50 and 500 mTorr in the presenceof the first plasma treatment that includes a radiofrequency power inthe range of about 50 to 200 Watts, a temperature in range of about 0°C. to about 100° C. for a time period in a range of about 0.5 to about10 minutes.

In some embodiments of the process 100, following exposure to watervapor as humid air (in step 120), in step 130, the substrate surface 210having the water layer 220 thereon is exposed a flux of plasma-cracked,reactive organic or ceramic precursor intermediates. Illustratively,such intermediates can be formed from monomers introduced into amodified plasma environment, under conditions that preserve theintegrity of the reactive intermediate species formed. Specifically, theplasma generation conditions should not result in the totalfragmentation or decomposition of the precursor molecules, nor shouldthe intermediates have very short residence time in the reactor. Also,the intermediates should be able to adsorb and react on the water layeron the cleaned and activated substrate surface 210.

In some embodiments the water layer 220 formed in step 120, is desirablynot greater in thickness 230 than about 2 nanometers. When the waterlayer thickness 230 is greater than 2 nanometers, the outermost watermolecules of the layer 220 are not tenaciously bound, either chemicallyor physically, to the substrate surface 210. These outermost watermolecules can desorb and react with the incoming precursor species instep 130 to form new species which may be undesirable or not beneficialto the film deposition process 100. Furthermore, the desorbed excesswater molecules can adsorb on the plasma chamber walls 240, and later onleach off of the wall 240 to thereby contaminate and impede the filmdeposition process 100. Experiments performed as part of the presentdisclosure, suggest a water layer thickness 230 of 0.1 to 2 nanometersproduces a balanced situation where the benefits of the water layer 220are realized while avoiding the undesirable effects of excess water.

While not limiting the scope of the invention by theoreticalconsiderations, it is thought that, in some cases, under the reducedpressure of the process conditions used in step 130, all or some of theadsorbed water layer 220 can be lost through desorption. During step130, it is also thought that water molecules of the layer 220 candeprotonate to afford reactive oxygen-radical rich surfaces withchemically unsatisfied dangling bonds exposed to the flux of crackedmonomer intermediates. The reactive surface is thought to rapidly reactwith the reactive species in the process chamber 215 to form strongchemical bonds (e.g., covalent bonds), which result in the grafted layer225 being bonded to the substrate surface 210.

In some cases, the deposited film 202 having the grafted layer 225 ofreacted pre-cursor molecules, after step 130, retains at least part ofthe water layer 220 in-between the surface 210 of the substrate 205 andthe grafted layer 225. For example, in some cases, the retained waterlayer 220 has a thickness 230 in a range from about 0.1 to 2 nanometers.For example, in some cases, the retained water layer has a thickness 230in a range from about 0.3 to 1.8 nanometers (e.g., a stack of about 1 to6 self-assembled monolayers of water). In such embodiments, it isthought that the molecules of the water layer 220 form a bonding linkbetween the grafted layer 225 of reacted pre-cursor molecules and thesubstrate surface 210.

In some embodiments of the process 100, organic (e.g., simple olefins tofluoro-olefins) or pre-ceramic monomers pre-cursor molecules are appliedin step 130 to form graphed layers 225 having a thickness 235 in a rangeof about 50 to 500 nanometers. In some embodiments the grafted layer 130(and in some cases retained water layer 220) provide complete coverage,conformal to an irregular substrate surface 210 and are tightly boundedwith high durability.

In some embodiments of the process 100, the precursor molecules in step130 include hexafluoropropylene and Argon at pressures between about 100and 500 mTorr and the second plasma treatment includes: a radiofrequencypower in the range of about 50 to 250 Watts, a temperature in range ofabout 10° C. to about 80° C. for a time period in a range of about 15 toabout 60 minutes.

As further illustrated in FIG. 2, the process 100 can further include astep 140 of evacuating the plasma chamber 215 of the first plasmareactants (e.g., in step 110) after forming the activated substratesurface 210 and before introducing the water vapor into the plasmachamber 215 (e.g., in step 120). For instance, some embodiments of step140 evacuating the plasma chamber 215 includes reducing the atmosphericpressure in the chamber 215 to less than about 100 Torr for at leastabout 5 minutes. Step 140 can advantageously mitigate the formation ofundesirable or not beneficial species from the reaction between thewater vapor introduced in step 120 and plasma reactants formed in thechamber 215 in step 110.

In some embodiments of the process 100, it is desirable to introduce thewater vapor into the chamber 215 in step 120 to form the water layer220. For instance, in some cases, the water vapor is in the chamber 215when the second plasma treatment (e.g., step 130) is commenced. That is,as part of step 120 the water vapor is introduced into the plasmachamber to expose the activated surface to the water vapor beforeintroducing the pre-cursors molecules into the plasma chamber 215 (e.g.,step 130). It is also desirable to introduce the water vapor for asufficient period to form the desired thickness 230 of water layer 220but as discussed above, not to form an overly thick layer 220. Forinstance, in some cases, the water vapor is in the chamber 215 for atleast about 5 minutes before the second plasma treatment in (e.g., step130) is commenced. For instance, in some cases, the water vapor is inthe chamber 215 for at least about 5 minutes and not longer than 10minutes before the second plasma treatment is (e.g., step 130) iscommenced. It is also desirable to introduce the water vapor in asufficient concentration to form the desired thickness 230 of waterlayer 220 and not to form an overly-thick layer 220. For instance, insome cases, as part of step 120, introducing the water vapor into theplasma chamber 215 includes introducing air into the chamber, whereinthe air has a humidity of least about 45 percent at about 20° C. for atleast about 5 minutes, and in some cases, not longer than about 10minutes, before introducing the pre-cursors molecules into the plasmachamber 215 (e.g., step 130).

In some embodiments of the process 100, a single-pass through steps 110,120, 130 (and sometimes optional step 140) is sufficient to product thedesired film layer 202 and therefore in decision step 150, it is decidedthe target film has been achieved and the process 100 is ceased at stopstep 160. However in other cases, if it is decided in step 150 that thefilm layer should comprise multiple grafted layers 225, the process 100can include repeating in step 170, at least one time, each of thesequence of steps of exposing the surface (step 110), introducing thewater vapor (step 120) and introducing the pre-cursors molecules (step130) and sometimes optional step 140. There can be repeated passes,e.g., a three or more passes, through steps 110, 120, 130 and sometimesoptional step 140. For instance, as further illustrated in FIG. 2, therecan be multiple pairs of retained water and grafted layers 220, 220′,225, 225′ that comprise the film 202 formed by such repeated passes inaccordance with step 170.

For instance, there is no upper limit to the number post surfaceactivation steps and hence the number of layers of different materialsthat can be deposited on the substrate surface 210. As illustrated inthe examples to follow, the process 100 is compatible with a wide rangeof substrate material composition and shapes, as well as monomerchemistry types that can be deposited in step 130. The surfacecharacteristics of the final film 202 can be adjusted according to thesecond plasma treatment conditions and pre-cursor molecules in each passthrough steps 110-140.

Presented below are examples of how the above-described steps in theprocess 100 could be monitored and implemented for particularembodiments of films 202 (sometimes referred to as a coating herein) onvarious types of substrate surfaces. Additional examples of first andsecond plasma treatments as part of steps 110 and 130, as also presentedin U.S. application Ser. No. 12/206,013 and U.S. Provisional ApplicationSer. No. 60/970,582 which are incorporated by reference if reproduced intheir entirety herein. Still other examples of first and second plasmatreatments as part of steps 110 and 130 are presented in U.S. Pat. Nos.6,579,604 and 6,846,225 which are incorporated by reference herein intheir entirety.

A film layer 202 modification of a substrate surface 210, such as formedin accordance with the process 100 in FIG. 1 and as depicted in FIG. 2,can be characterized by time-of-flight secondary ion mass spectrometry(TOF-SIMS). FIG. 3 shows a generalized simulated expected TOF-SIMS traceof such a surface. In this example application, “Oxide Yield” is definedas the detected relative concentration of oxygen containing speciesemanating from the sputtered surface reaching the detector of theTOF-SIMS tool. In the trace depicted in FIG. 3, the time from T₀ to T₁represents the time it takes to sputter through the outermost graphedlayer 225 in FIG. 2. The time T₁ to T₂ represents the time it takes tosputter through the residual water-derived interfacial water layer 220.

In this disclosure, atomically clean surfaces can be characterized bytime-of-flight secondary ion mass spectrometry (TOF-SIMS) traces devoidof any elemental yields other than that of the substrate. The suitablematerials for deposition by some embodiments of the disclosure offer avery wide range of physical, chemical and optical properties and someare well known polymers from bulk polymerization processes. For example,self-cleaning barrier films or coatings that provide catalyticself-cleaning and barrier properties (e.g., layers of TiO₂ ZnO₂ andSnO₂) can be formed. TiO_(x) structures on a variety of substrates havebeen demonstrated using embodiments of the process. In this disclosuremetal oxides of uncertain stoichiometry are denoted as MO_(x) whereM=Si, Al, Ti, Ta, Zr, Zn, Sn, or Zr, and, —O_(x) represents oxide orsub-oxides (e.g., x=1 to 4 in some cases).

Using the multi-stage platform for nanoscale plasma enhanced single andmulti-layered organic and ceramic nanoscale films 202 can be establishedon any substrate 205 of arbitrary composition and geometry. Thisflexibility permits the capability to tailor the surface modificationchemistry to many applications. As an illustrative example, FIG. 4 showsan optical interferometry of a masked step edge silicon oxide (SiO_(x))plasma assisted film on a glass substrate produced by a two-stageprocess where tetraethoxysilane (TEOS) was used as the precursormolecule in the final stage (step 130). The applied film 202 is dense,smooth and of about 200 nm in thickness.

The specific properties of the deposited film 202 are sensitive to theprecise process conditions used in the deposition. It is well known inthe art that in the case of deposition on thermoplastic substrates, itis important to conduct the deposition at low temperatures to avoiddimensional distortion of the substrate. Likewise, the process of thecurrent invention is designed to circumvent the typical 1-2 day surfacereversion to low energy observed for many thermoplastic substratestreated with plasma. This invention takes advantage of the surprisingbeneficial effect of humid air on the atomically cleaned substratesurface to provide compact conformal films with excellent conformalbarrier films with excellent adhesion properties. The customizedversions of the multi-stage platform for nanoscale plasma enhancedcoatings can afford a rapid low cost method for applying applicationspecific coating combinations to industrial parts to improve impactstrength, abrasion resistance and corrosion resistance. Examples of thedemonstrated coatings include, but not limited to titanium oxidecoatings for glass objects, silicon oxide coatings for corrosionresistant rotor blades and aircraft parts.

A film 202 can be formed of polymeric materials by a process 100 thatincludes exposing a polymeric substrate to at least two plasmatreatments (e.g., in steps 110 and 130). A first plasma treatmentcreates a modified reactive surface on the substrate. The subsequentsecond plasma treatment produces a grafted layer 225 thereon. Theinitial plasma treatment is done while controlling the temperature of aradiofrequency electrodes to about 10 to 100° C.

The specific conditions used during the first plasma treatment canstrongly influence characteristics of the polymeric substrate's surface.For instance, different initial plasma treatments followed by the samesubsequent plasma treatment can result in grafted layer surfaces thatare either hydrophilic or hydrophobic. The first plasma treatment caninclude a plasma reactant such as Helium, Argon, Nitrogen, Neon, Silane,Hydrogen and Oxygen and mixtures thereof. In some cases, the initialplasma treatment reaction is conducted at a radiofrequency power of 30to 500 Watts.

The second subsequent plasma treatment can have subsequent plasmareactants that include vinyl or acrylic monomers. Example monomersinclude monomers 1-Vinyl-2-pyrrolidinone, 2-Hydroxyethylmethacrylate,Allyl Alcohol, Allyl Amine, Substituted Allyl Amines of 4-10 CarbonAtoms, Acrylic Acid, Acrylic Esters of 2-10 Carbon Atoms, Acrylamides of3-10 Carbon Atoms. In some cases the resulting surface can be used as atie layer under a conventional solvent, spray, dip or powder coating.The conventional coating can then be used to bind a drug or othertherapeutic material. In other cases, the subsequent plasma treatmentcan have subsequent plasma reactants that include metal alkoxide estersof Silicon, Titanium, Tantalum, Aluminum, Zirconium, or Zinc.

The process 100 can adapt the multi-pass plasma grafting techniquedescribed above into a multiple step process specifically designed formodifying and functionalizing the surfaces of medical devices. Anadvantage of the method described in this application is the ability toapply coatings on a dry-in dry-out basis, and/or in a sterile anaerobicenvironments. Using this method, parts can be placed into a treatmentchamber dry and emerge after treatment both dry and sterile. The thinfilm coatings produced by the disclosed techniques are chemically bondedto the surface and are thus highly resistant to adhesion failures,delamination, flaking or debonding. The films are also coherent anduniform and are resistant to decohesion and tearing. Areas of the coateddevices that need to remain non lubricious can be easily masked duringthe plasma coating process. The lubricity of the coating is activated bytreatment of the surface with water or body fluids.

The so-deposited film stack 202 could be comprised of organic and orinorganic polymers. The organic polymers are made from monomers can beselected of a group comprising, but not limited to, common lubriciousmonomers such as N-vinylpyrrolidinone and hydroxyethylmethacrylate andtheir copolymers ethylene and propylene oxide and their derivatives. Thepolymers are created in-situ at the substrate surface from treatment ofthe substrate in the plasma/monomer environment.

These plasma created polymer coatings provide lubricity when contactedwith water or saline solution. The coated device is dry to the touchprior to water treatment for facile handling by medical or surgicalpersonnel. The mechanical properties of the coatings, such as theflexibility of the deposited coating, can be modified by incorporationduring the plasma polymerization of volatile crosslinking agents such asdiallylethers, polyallylamines, gylcoldiacrylates orglycoldimethacrylates into the monomer stream. Monomers with reactivefunctional groups containing amine, hydroxyl, and carboxylic acidfunctional groups can provide sites for the further coupling of surfacebinding or other materials and polymers, including designer drugs fortargeted delivery. For example, known lubricious urethane polymers canbe attached to preceding layers containing these reactive surfaces.Further, direct attachment or binding of gel mixtures of antibiotic orother drugs can be accomplished using standard solution coating or gasphase under non-plasma vacuum/reduced pressure techniques. The coatingsof this invention, including common lubricious monomers such asN-vinylpyrrolidinone, which provides lubricity when contacted with wateror saline solution, have been applied on a dry-in/dry-out basis. Thecoated device is dry to the touch prior to water treatment for facilehandling by medical or surgical personnel. Further, coating of monomerswith reactive handles containing amine, hydroxyl, and carboxylic acidfunctional groups can provide sites for the surface binding ofantibiotic or other drugs have been demonstrated.

Table 1 is a compendium of the conditions in a coating processes onmiscellaneous substrates using the process 100 which includes two steps:a first plasma treatment in accordance with step 110 (step P1) and asecond plasma treatment in accordance with step 130 (step P2), and thecharacterization data of the resultant articles. The substrates used inthese experiments were made from polymers commonly associated withbiomedical devices. In all cases, the modified surfaces showed permanentimprovements in their hydrophilic (reduced water contact angles relativeto the untreated substrates)

TABLE 1 A compendium of the processing conditions, and thecharacterization data of the resultant articles. The first plasmatreatment (P1 stage) and second plasma treatment (P2 stage) areinterspersed with humid air exposure in accordance with step 120. P1 P2Sample P1 RF P1 P1 Pres- P2 P2 RF P2 RF P2 Pres- ID Substrates PowerTime Gas sure Monomer Power Time Gas sure 1-10A Tygon Tubing NA NA NA NANA NA NA NA NA 1-10B Tygon Tubing 50 4 20% O2, 350 TYZOR TPT 50 20 Ar350 80% Ar 1-3B Tygon Tubing 100 15 Ar 250 TEOS 50 20 Ar 250 1-5A TygonTubing 100 15 Ar 250 2-Hydroxyethyl 50 20 Ar 250 Methracrylate 1-2BTygon Tubing 100 15 250 N-Vinylpyrrolidinone 50 20 Ar 250 1-11A RedRubber 50 3 20% O2, 350 Hexamethyldisilazane 50 20 Ar 350 Bard Urethral80% Ar Catheter 1-5E Lexan Panel 50 5.5 20% O2, 350 2-Hydroxyethyl 50 20Ar 350 80% Ar Methracrylate 1-10C Polycarbonate 50 4 20% O2, 350 TYZORTPT 50 20 Ar 350 Panels 80% Ar 1-5A Silicone Medical 100 15 Ar 2502-Hydroxyethyl 50 20 Ar 250 Tubing Methracrylate 1-3C Silicone Medical100 15 Ar 250 TEOS 50 20 Ar 250 Tubing 1-3C Silicone Medical 100 15 Ar250 TEOS 50 20 Ar 250 Tubing 1-3D Epoxy/Graphite 100 15 Ar 250 TEOS 5020 Ar 250 Cylinder 1-3B Latex Gloves 100 15 Ar 250 TEOS 50 20 Ar 2501-10D Latex Gloves 50 4 20% O2, 350 TYZOR TPT 50 20 Ar 350 80% Ar 1-5ALatex Gloves 100 15 Ar 250 2-Hydroxyethyl 50 20 Ar 250 Methracrylate

The data in Table 1 shows that the process conditions used in the atomiccleaning and activation step P1 (step 110 of FIG. 1) strongly influencethe eventual surface characteristics. For example, starting with samesubstrate and finishing with identical monomer and plasma step P2conditions, sample 1-3F is hydrophilic while sample 1-5D is hydrophobic.The principal difference is in the plasma step P1 process condition; theprocess gas composition, plasma power and time were different.

TABLE 2 A compendium of the 2-Step processing conditions ofMiscellaneous Substrates, and the characterization data of the resultantarticles. The P1 and P2 stages are interspersed with humid air exposurein accordance with step 120. P1 RF P1 P1 P2 RF P2 P2 Contact SubstratesPower Time P1 Gas Pressure P2 Monomer Power Time P2 Gas Pressure AngleTygon Tubing NA NA NA NA NA NA NA NA NA 102 Tygon Tubing 50 4 20% O2,350 TYZOR TPT 50 20 Ar 350 82 80% Ar Tygon Tubing 100 15 Ar 250 TEOS 5020 Ar 250 TygonTubing 100 15 Ar 250 2-Hydroxyethyl 50 20 Ar 250Methracrylate Tygon Tubing 100 15 250 N-Vinylpyrrolidinone 50 20 Ar 25069 Red Rubber Bard 50 3 20% O2, 350 Hexamethyldisilazane 50 20 Ar 350 70Urethral Catheter 80% Ar Lexan Panel 50 5.5 20% O2, 350 2-Hydroxyethyl50 20 Ar 350 80% Ar Methracrylate Polycarbonate Panels 50 4 20% O2, 350TYZOR TPT 50 20 Ar 350 80% Ar Silicone Medical 100 15 Ar 2502-Hydroxyethyl 50 20 Ar 250 Tubing Methracrylate Silicone Medical 100 15Ar 250 TEOS 50 20 Ar 250 Tubing Silicone Medical 100 15 Ar 250 TEOS 5020 Ar 250 Tubing Epoxy/Graphite 100 15 Ar 250 TEOS 50 20 Ar 250 CylinderLatex Gloves 100 15 Ar 250 TEOS 50 20 Ar 250 Latex Gloves 50 4 20% O2,350 TYZOR TPT 50 20 Ar 350 80% Ar

In some embodiments, substrates 205 comprising feeding tube connectorsand balloon catheters are surface modified by of the process 100resulting in a graphed layer 225 of an elastomeric conformal coating. Insuch an embodiments of the precursor molecule of step 130 can includepolymerize 2-methyl-1,3-butadiene (isoprene) onto a variety ofsubstrates using a single pass through of the process 100 (steps110-130, and in in some cases step 140). This is a special case of thegeneral olefin polymerization process, since a coating is produced whichcan be further cross-linked by plasma post treatment or by other means

In some embodiments, device substrates 205 benefit from a dry lowfriction, biologically inert grafted layer 225 surface with low adhesionto the biological tissues. These surfaces can be described as “drylubricious”. Such surfaces are useful in particular for invasive medicaldevices such as catheters, arthroscopic tubes and implements. Implementsof this type are advantageous during surgical insertion since noadditional surface treatment water or external fluids are requiredduring insertion. Some such embodiments of the disclosure usecommercially available fluoro-monomers in producing low energy,hydrophobic, low coefficient of friction coatings via our two stageplasma coating process.

In some cases, the process 100 comprises a first grafted layer 225 of aconformal organic coating and subsequent grafted layers 225′ (one ormore repeated passes in accordance with step 170) of a plasma-assisteddeposited, ceramic metal oxide coating. The forming of a plurality ofsubsequent grafted layers 225′ (and in some cases water subsequentlayers 220′) where there exists one or more subsequent grafted layer 225and (in some cases subsequent water layer 220) can in some cases includein step 110 exposing the upper-most preceding grafted layer 225 to ashort burst of inert gas plasma designed to clean at the atomic leveland to activate the surface of the preceding grafted layer 225, and thenexposure to humid air in step 120, followed by plasma assisteddeposition of a thin film comprised of ceramic metal oxide ofceramic-polymer hybrid conformal surface in step 130. In some cases, theceramic metal oxide is in step 130 chosen from the group of Si, Al, Ti,Ta, Zr, Zn, Sn, Zr. The ceramic metal sub-oxide is chosen from the groupof Si, Al, Ti, Zr, Zn, Sn, Zr.

In other cases, the subsequent graphed layer 225′ can be anotherconformal organic coating such as an olefinic deposited conformalsurface. In some cases, one or both the preceding graphed layer 225 andsubsequent graphed layer 225′ includes an olefinic precursor moleculeschosen from the group of tyrene, 1-Hexene, or isoprene. In some cases,one or both the preceding graphed layer 225 and subsequent graphed layer225′ includes an olefinic precursor molecules that are paracyclophanes,such as parylene. In some cases, the organic coating is an olefinichydrocarbon of 4-15 carbon atoms. In some cases, the organic coating isstyrene. In some cases, one or both the preceding graphed layer 225 andsubsequent graphed layer 225′ includes an olefinic precursor moleculesthat are olefinic hydrocarbon of 4-15 carbon atoms.

In some embodiments, the precursor molecule used in step 130 is amonomer selected for subsequent direct chemical reaction binding of thegrafted layer 225 to the substrate surface 110 are taken from the groupof: acrylic acid, primary and acrylamides of up to 10 carbon atoms,allyl alcohol, primary and secondary allylamines up to 15 carbon atoms,allylglycidylether, hydroxyethylacrylate and methacrylate,hydroxypropylacrylate and methacrylate. In some embodiments theprecursor molecules used in step 130 is 4-diallylaminopyridine. In somecases the subsequent grafted layer 225′ can be fromed from precursormolecules of acrylic and methacrylic acids, tertiary allylamines in somecases 4-diallylaminopyridine.

In some embodiments, the film layer 202 produced is active in destroyingchemical warfare agents. In some cases, the film produced is active indestroying toxic industrial fluids. In some cases, the film produced bythe current invention is active in destroying organic molecules underelectromagnetic wave irradiation. In some cases, the film 202 producedis active in destroying metal-organic complex molecules underelectromagnetic wave irradiation.

In some embodiments the precursor molecule used in step 130 provides aconformal inert hydrogenated amorphous carbon film coating 202, in somecases containing sp3 and sp2 hybridized carbon, as well as C—H bonds,e.g., formed from precursor molecules that include volatile carbon-richfluids such as one or more of carbon tetrachloride, chloroform, benzene,and xylene In some cases, the subsequent or second grafted layer 225 isa conformal inert hydrogenated amorphous carbon film coatings, formed ina repeated pass in accordance with step 170.

In some embodiments, the precursor molecule used in step 130 provides aconformal electrically and or thermally conducting film 202, e.g.,formed from precursor molecules that include pyrrole, thiophene andaniline.

Some further illustrative examples of films 202 formed in accordancewith the process 100 as presented below:

Example 1

Polypropylene tubes, polyethylene test tubes, aluminum sheet, and maskedglass microscope slides, were placed in a plasma deposition chamber heldbetween 0° C. and 100° C. and activated with Argon plasma at pressuresbetween 50 and 500 mTorr at power between 50 and 200 Watts. Followingactivation, humid air or water saturated air was allowed to bleed intothe deposition chamber until the chamber pressure reached 1 atmosphere,and then the system was evacuated to base pressure. The plasma assisteddeposition stage was then initiated. Hexafluoropropylene was introducedinto the plasma chamber under Argon plasma at pressures from 100 to 500mTorr and power between 50 and 250 Watts and treatment was continued forbetween 15 to 60 minutes.

The process produced a yellow conformal coating. The thickness of thecoating increased monotonically with increasing stage-two treatmenttime, reaching a thickness of about 100 nm in 60 minutes on all of thetest surfaces. This suggests that the film deposition rate depended onthe reactive precursor species reaching the activated surface, where itis readily incorporated into the growing film.

The films produced on all the test surfaces were smooth and hydrophobic,with static water contact angles of between 120°-125° C. and no contacthysteresis. The films were also highly adherent to the substrates, basedon the results from a modified qualitative “Scotch tape peel” tests. Inthese tests, a piece of Scotch™ brand tape was firmly pressed onto thecoated substrate for 5 minutes and then quickly removed at 90-degrees.If little or none of the yellowish coating was peeled substrate surface,then the adhesion of the film to the substrate is considered good. Allthe tested samples, produced in this example passed this test.

Example 2

Experiments were conducted to evaluate the efficacy of various barriercoatings in protecting electronic circuitry. In this example, theability to reduce the shifts caused by autoclaving in the air flowcharacteristic of arthroscopic flow-meters was evaluated. The device wasbuilt as normal, calibrated for air flow and verified in normal ambienttests. The devices were then disassembled, and the control electronicscoated by the methods of this invention, as described below. The deviceswere then reassembled with coated electronics boards then retested forair flow at pre-determined set points.

In one embodiment, an electronic board previously coated with Parylene-Cwas subjected to a two stage plasma activation and deposition process.The first stage was carried out in argon plasma at 250 mTorr at 100 Wpower for up to 5 minutes. Following activation, humid air or watersaturated air was allowed to bleed into the deposition chamber, whichwas partially pre-filled with an inert gas, until the chamber pressurereached 1 atmosphere, and then the system was evacuated to basepressure, backfilled with the inert gas and pumped down to base pressuretwice before the plasma assisted deposition stage was then initiated. Inthe plasma assisted deposition stage, subsequent,tetraethyloxyorthosilane [TEOS] was introduced and plasma conditions of250 mTorr and 100 W maintained for 25 minutes to yield a conformalSiO_(x) overcoating.

In another embodiment, a circuit board controller was first subjected toa two stage plasma activation and deposition process. The first stagewas carried out in argon plasma at 250 mTorr at 100 W power for up to 5minutes. In the plasma assisted deposition stage,Tetraethyloxyorthosilane [TEOS] was introduced and plasma conditions of250 mTorr and 100 W maintained for 25 minutes to yield a conformalSiO_(x) coating. This was followed by thermal vapor coating withParylene-C, and then finally coated again with the two stage plasmaprocess, interspersed with humid-air breaks of Example 1 to create athree layer conformal barrier coating.

The electronic control boards were evaluated using a modified unbiasedautoclave test (JEDEC Standard JESD22-A102, http:www.jedec.org,incorporated by reference herein in its entirety). The JEDEC StandardJESD22-A102 test is a highly accelerated test which employs conditionsof pressure, humidity and temperature under condensing conditions toaccelerate moisture penetration through the external coating materialsand along the interface between the external protective film materialand the underlying metallic components. The autoclave test used tosimulate device survivability in harsh conditions and/or long-termreliability testing. The circuit boards were subjected to multiple heatand cool cycles.

Large air flow deviations at low flow set points are characteristics ofthe flow meters tested in this example, and such deviations were used asindex of flow meter performance. In these tests. The failure criterionis a flow deviation at 20%; any device showing flow deviation of greaterthan 20% at any gas flow set point is considered to have failed.

FIG. 5 and Table 4 summarize the results from these tests. The resultsclearly show that the under- and over-coat of parlyene with SiO_(x) fromthe current invention significantly improved the performance and thelong-term reliability of the control electronics evaluated.

TABLE 3 Summary of the results from Autoclave Cycling tests in Example 2Max Number of Coating Type Cycles Before Fail None 0 40 nm Parylene Only10 40 nm Parlyene + 100 nm SiO2 Overcoat >20 100 nm SiO2 undercoat/40 nmParlyene/100 nm >20 SiO2 overcoat

Example 3

Polyethylene blow-molded fuel tanks for small engines were sealed tomitigate permeation of hydrocarbon fluids. The untreated tanks haveinherent permeability of hydrocarbon fluids and the current state of theart mitigation treatments, such as gaseous fluorination of the tanksurfaces in large chambers and multilayer polymer co-extrusion areenvironmentally less preferred and capital intensive respectively.

A commercial polyethylene blow molded small engine fuel tank (e.g.,obtained from Mergon Corporation, Anderson, SC) was coated with SiO_(x)using the process of this invention. The blow molded fuel tanks werecoated in the two stage plasma process consisting of a plasma activationstage from 2-10 minutes at 50-100 W Argon plasma at 100-500 MTorr,preferably at 250 mTorr, followed by a plasma grafting stage, whereTetraethyloxyorthosilane [TEOS] was introduced. The plasma conditions ofthe grafing stage were 100-250 MTorr and 100 W maintained for 25minutes. The resultant thickness of the conformal SiO_(x) over-coatingwas about 150 nm.

To evaluate the effectiveness of the coatings in suppressing fuel loss,the coated tanks were filled with commercial 87 octane gasoline, closedwith a commercial small engine fuel tank cap, placed in a covered, 10gallon polyethylene buckets, and stored at room temperature for 26months. Identical, but uncoated control tanks were likewise filled andsimilarly stored. After 26 months, the mean net weight of the fuelremaining in the coated tanks was 397 g, as compared to 372 g remainingin the uncoated tanks. This demonstrates that the conformal coatingsfrom this invention deposited on the fuel tanks were effective inmitigating hydrocarbon fuel loss due to permeation polyethylene blowmolded fuel tank.

Example 4

In a series of demonstration experiments, multi stage plasma basedcoatings were produced with a variety of olefinic monomers (Styrene,1-Hexene, Isoprene) in the subsequent grafting stage to producenanoscale conformal barrier coatings. The substrates were coated in thetwo stage plasma process consisting of a plasma activation stage from1-10 minutes at 50-100 W argon plasma at 100-500 mTorr, preferably at250 mTorr, followed by a plasma grafting stage, where olefinic monomerswere introduced. The plasma conditions of the grafting stage were100-250 mTorr, and preferably 100 W maintained for up to 30 minutes.Coatings were applied to polypropylene and polyethylene tubes,polycarbonate and acrylic sheets, aluminum sheets, and borosilicateglass slide substrates. The coatings were uniform, smooth and adherentbetween 60 and 200 nm in thickness deepening on specific processconditions. FIG. 6 shows an optical interferometry example image of anexample 60 nm styrene coating edge on a de-masked borosilicate glasssample.

Other functional olefinic monomers can likewise be employed by themethods of this invention to produce reactive grafted surface polymers.

Example 5

The reactive surfaces demonstrated in example 4 can be employed as tieand/or priming coats and sub-coats to bind other materials to thesurface or to catalyze chemical reactions at the surface. In example 1,the grafting of allyl alcohol and allylamine to a variety of substrateswere demonstrated. In this example, other suitable monomers such asallylglycidylether, were used to graft a reactive epoxy coating onto thesubstrate, and then used to couple 4-diallylaminopyridine, to produce agrafted dialkylaminopyridine catalytic surface. Polymericdialkylaminopyridines have been shown to be useful in catalyzing thedestruction of chemical warfare agents and toxic industrial materials.(See e.g., Yokley and Nielsen, US Patent Application, US20110028774,Hypernucleophilic Catalysts for Detoxification of Chemical ThreatAgents, incorporated by reference herein in its entirety).

Example 6

Electrically conducting coatings were applied to polypropylene andpolyethylene tubes, polycarbonate and acrylic sheets, aluminum sheets,borosilicate glass slides and on inter-digitated conductive teststructures; the substrates were treated in a two phase plasma coatingprocess. The activation phase was conducted at 75 W power at 300 mTorrpressure using a 67% argon and 33% air plasma for 2 minutes. Thesubsequent phase admitted pyrrole into the plasma chamber at a pressureranging from 300-400 mTorr for 75 W for 30 minutes. The chambertemperature rose from 12° C. to 18° C.

A thin colorless conformal coating of about 12 nm in thickness wasdeposited as characterized with an optical interferometry. The coatingswere uniform, smooth and adherent. The electrical conductivity of theprepared conducting polymer films (comprised of mostly polypyrrole) wasmeasured at room temperature by four-point probe technique, taking theaverage value of several readings at various points of the films. Theelectrical data varied significantly from site to site over the samples,and from sample to sample. The best conductivity of the as-depositedundoped films measured was about 1×10⁻² S/cm.

Example 7

Inert hydrogenated amorphous carbon film coatings (possibly containingsp3 and sp2 hybridized carbon, as well as C—H bonds) were applied topolypropylene and polyethylene tubes, polycarbonate and acrylic sheets,aluminum sheets, and glass slides; the substrates were treated in a twophase plasma coating process. The activation phase was conducted for 2minutes at 175-300 mTorr and 75 W power, with argon as the backgroundgas. In one embodiment, Carbon Tetrachloride (CCl₄) was introduced intothe plasma chamber with argon as the carrier and background gas in thesubsequent phase, at 75 W power and 175-300 mTorr for 30 minutes. Inanother embodiment, xylene (C₇H₈) was introduced into the plasma chamberwith argon as the carrier and background gas in the subsequent phase,also at 75 W power and 175-300 mTorr for 30 minutes.

In both embodiments, the process produced a colorless conformal andhydrophobic coating. The thickness of the coating increasedmonotonically with increasing stage-two treatment time, reaching athickness of about 150 nm in 30 minutes on all of the test surfaces.This suggests that the film deposition rate was independent of thecarbon source, but depended only on the reactive precursor speciesreaching the activated surface, where it is readily incorporated intothe growing film.

Example 8

Specialty filtration membranes and related devices are becoming anintegral part of bioprocessing, semiconductor and other high valueindustrial processes. Likewise, micro-reactor technology where theconfigurations take advantage of high reactor surface to volume ratiosto achieve specific surface binding of catalysts or other reactionmodifiers are becoming items of intense study. In most cases the filtermedia are made from chemically inert and low surface energy materialssuch as polyethylene, polypropylene, other polyolefins or polysulfone.The coatings of this invention have the ability to directly andselectively modify the chemical properties of channels, micro-pinholesand tortuous paths of specific filters. The coatings of this inventionare uniquely able to perform these operations since the activation isdriven by the plasma which accesses all surfaces within the plasmareaction chamber, and the volatile monomers are delivered to theactivated surface sites in the gas phase. The advantages of a rapid,general, and chemically flexible system that can be used on finishedconfigurations on a dry-in/dry-out basis are clearly evident to thoseskilled in the art.

In this example, an embodiment of the process 100 of the disclosure wasused to modify a variety of filter membranes materials, to createsurfaces capable of binding metal ions through dative bonding. Forexample, by functionalizing the membrane with soft ligands (e.g.,aliphatic-, thiols, amines, etc.) one can selectively bind coinage metalions (Ag, Au, etc. . . . ). Specifically, the allyamine surfaces createdin example 1, bind copper ions, and were used to reduce theconcentration of Cu²⁺ in aqueous solutions placed in contact with suchsurfaces.

Example 9

The performance of polyvinylalcohol (PVA) objects (e.g. PVA brushes) inaqueous environments are constrained by, but not limited to, thedifficulties in hydration (requiring brushes to shipped in wetenvelopes), bio-fouling (bacteria growth in the brushes leading to highparticle count) and lack of application specificity (′one-size fits all′approach, use the same brush for all substrate)

Current efforts to address these concerns utilize modifications to thecomposition of the aqueous environments (e.g., cleaning solutions,etc.). Such modifications are not always successful. We propose tomitigate these limitations, without negatively impacting performance,with appropriate choice of secondary coatings on the brush bristles.

Specifically, using the inventions in this disclosure the inventorssuccessfully modified commercial PVA brushes with secondary coatingsthat bind detrimental metallic species, such as Cu- and other metallicions, to proactively address yield and reliability limiting dielectriccontamination in semiconductor manufacturing. By appropriate choice ofsuch coatings, it is possible to also prevent bio-fouling (bacteriagrowth in the brushes leading to high particle count) and lack ofapplication specificity.

Example 10

The effects of sand erosion and/or ablation on helicopter rotors bladesis a perennial problem in sandy environments and rotor blade replacementrepresents a significant cost over a helicopter's operational life. Mosthelicopter rotor blades include erosion protection in the form ofleading edge strips made from metals such as nickel, titanium andstainless steel. Polyurethane-based coatings, tapes and boots have alsobeen used for erosion protection. However, neither strategy givesoptimal erosion resistance from both rain and sand. Metal leading edgeshave excellent rain resistance but poor sand erosion performance.Conversely, polyurethane-based coatings have good sand erosionprotection, but poor rain resistance.

Increased durability of ceramic modified thermoplastics in corrosiveaqueous abrasive environments have been demonstrated. In particular, twostage plasma based coatings of this invention of SiO_(x) and TiO_(x) toboth thermoplastic and thermoset materials are used to improvedurability. The coatings of this invention, in particular the inorganicoxides as applied to the previously described polyurethane rotorprotection boots can provide effective aqueous surface protection in ahigh abrasive environment.

Those skilled in the art to which the invention relates will appreciatethat other and further additions, deletions, substitutions andmodifications may be made to the described embodiments without departingfrom the scope of the invention.

What is claimed is:
 1. A electronic device, comprising: a substratehaving a component-side surface; and a moisture protection film coveringthe component-side surface, the moisture protection film including: afirst water layer bonded to component-side surface that is an activatedsurface, wherein the activated surface has a lower water contact anglethan the substrate surface before the surface activation; a firstgraphed layer of a plasma-reacted first set of precursor moleculesgraphed to the first water layer, wherein the first water layer forms afirst bonding link between the substrate surface and the reacted firstset precursor molecules; a second water layer bonded to the firstgraphed layer; and a second graphed layer of a plasma-reacted second setof precursor molecules graphed to the second water layer, wherein thesecond water layer forms a second bonding link between the second waterlayer and the reacted second set of precursor molecules.
 2. The deviceof claim 1, wherein: the component-side surface was exposed a firstplasma treatment having plasma reactants in a plasma chamber to form theactivated substrate surface; the first water layer was formed afterremoving the plasma reactants from the plasma chamber and thenintroducing water vapor into the plasma chamber to form the first waterlayer bonded to the activated surface; and then the plasma-reacted firstset of precursor molecules was formed in a second plasma treatment thatincludes introducing the precursor molecules of the first set into theplasma chamber at a plasma chamber pressure that is in a range from 100mTorr to 500 mTorr.
 3. The device of claim 2, wherein the precursormolecules of the first set include olefinic hydrocarbon of 4-15 carbonatoms.
 4. The device of claim 2, wherein the olefinic precursormolecules includes paracyclophanes.
 5. The device of claim 2, whereinthe olefinic precursor molecules includes parylene.
 6. The device ofclaim 2, wherein the precursor molecules of the first set includetetraethyloxyorthosilane.
 7. The device of claim 2, wherein: the secondwater layer was formed after removing the precursor molecules of thefirst set from the plasma chamber and then introducing water vapor intothe plasma chamber to form the second water layer bonded to the theplasma-reacted first set of precursor molecules; and then theplasma-reacted second set of precursor molecules was formed in a thirdplasma treatment that includes introducing the precursor molecules ofthe second set into the plasma chamber at a plasma chamber pressure thatis in a range from 100 mTorr to 500 mTorr.
 8. The device of claim 7,wherein the precursor molecules of the first set include olefinichydrocarbon of 4-15 carbon atoms.
 9. The device of claim 7, wherein theolefinic precursor molecules includes paracyclophanes.
 10. The device ofclaim 7, wherein the olefinic precursor molecules includes parylene. 11.The device of claim 7, wherein the precursor molecules of the first setinclude tetraethyloxyorthosilane.
 12. The device of claim 1, wherein thecomponent-side surface includes a borosilicate glass surface.
 13. Thedevice of claim 1, wherein the component-side surface includes a surfaceof a thermal vapor coating of parylene.
 14. The device of claim 1,wherein the component-side surface includes a surface of electricallyconductive polymer.
 15. The device of claim 1, wherein the first graphedlayer of the plasma-reacted first set of precursor molecules is aparylene layer and the second graphed layer of the plasma-reacted secondset of precursor molecules is a parylene layer.
 16. The device of claim1, wherein the first graphed layer of the plasma-reacted first set ofprecursor molecules is a silicon oxide layer and the second graphedlayer of the plasma-reacted second set of precursor molecules is asilicon oxide layer.
 17. The device of claim 1, wherein the firstgraphed layer of the plasma-reacted first set of precursor molecules isa silicon oxide layer and the second graphed layer of the plasma-reactedsecond set of precursor molecules is a parylene layer.
 18. The device ofclaim 1, wherein the first graphed layer of the plasma-reacted first setof precursor molecules is a parylene layer and the second graphed layerof the plasma-reacted second set of precursor molecules is a siliconoxide layer.
 19. The device of claim 1, wherein the moisture protectionfilm covering the component-side surface is a conformal coating.